Semiconductor Processors

Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.

Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.

Maintain processing, production, and inspection information and reports.

Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.

Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.

Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.

Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.

Load semiconductor material into furnace.

Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.

Load and unload equipment chambers and transport finished product to storage or to area for further processing.

Count, sort, and weigh processed items.

Calculate etching time based on thickness of material to be removed from wafers or crystals.

Inspect equipment for leaks, diagnose malfunctions, and request repairs.

Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.

Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.

Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.

Stamp, etch, or scribe identifying information on finished component according to specifications.

Operate saw to cut remelt into sections of specified size or to cut ingots into wafers.

Scribe or separate wafers into dice.

Connect reactor to computer, using hand tools and power tools.

Mount crystal ingots or wafers on blocks or plastic laminate, using special mounting devices, to facilitate their positioning in the holding fixtures of sawing, drilling, grinding or sanding equipment.

Attach ampoule to diffusion pump to remove air from ampoule, and seal ampoule, using blowtorch.

Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.

Locate crystal axis of ingot, and draw orientation lines on ingot, using x-ray equipment, drill, and sanding machine.